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High Thermal Conductivity AlN Ceramic Heat Sink

  • High Thermal Conductivity AlN Ceramic Heat Sink
High Thermal Conductivity AlN Ceramic Heat Sink
  • MSJ/ALN-009
  • aluminum nitride / aln ceramic
  • customized
  • 10 pcs per type
  • electronic components

AlN Ceramic Heat Sink is made from high-purity Aluminum Nitride Ceramic, a material known for its exceptionally high thermal conductivity and stable electrical insulation. Compared with alumina or zirconia ceramics, High Thermal Conductivity AlN offers a significant advantage in applications where heat must be transferred quickly and reliably.

Any inquiry please email info@mascera-tec.com or call +86 13860446139

Product detail

AlN Ceramic Heat Sink is made from high-purity Aluminum Nitride Ceramic, a material known for its exceptionally high thermal conductivity and stable electrical insulation. Compared with alumina or zirconia ceramics, High Thermal Conductivity AlN offers a significant advantage in applications where heat must be transferred quickly and reliably.


With thermal conductivity up to 170–180 W/m·K, this ceramic heat sink provides an efficient thermal path for high-power electronic modules, laser devices, RF components and compact circuit assemblies. Its thermal expansion coefficient matches closely with semiconductor materials, ensuring better reliability under thermal cycling.


Mascera supports customed AlN ceramic designs according to drawing requirements. Finned blocks, flat plates, precision-machined surfaces and special-shaped structures can all be manufactured to meet different installation spaces and cooling demands.


Main properties 

  • High thermal conductivity for rapid heat dissipation

  • Electrical insulation for high-voltage electronic assemblies

  • Low thermal expansion, compatible with Si and GaN devices

  • High mechanical strength and stable performance at elevated temperatures

  • Corrosion-resistant and contamination-free ceramic material

  • Available in customed AlN ceramic shapes and fin structures


Applications

  • Power modules (IGBT / MOSFET)

  • LED and laser packaging

  • RF and microwave devices

  • Telecom and base station equipment

  • High-density power converter boards

  • Semiconductor and sensor modules


Material Data Sheet

ITEMUNITTECHNICAL PARAMETERS
Purity
%95
ColorLight Grey
Densityg/cm3≥3.30
Hardness (HV0.5)-1130
Young’s modulusGpa310-320
Fracture ToughnessMpa.m1/23.5
Flexural Strength @25℃Mpa330
Compressive Strength @25℃Mpa2100
Thermal conductivity @25℃W/M.K≥170

Coefficient of Thermal

Expansion(20~300℃)

10-6/℃4.7
Thermal shock resistance△℃400

Max. Working Temperature

@Air conditio

900

Max. Working Temperature

@Inert gas protection condition

1800
Melting Point2500
Dielectric StrengthKV/mm17
Volume ResistivityΩ.cm>1014

Dielectric Constant(1MHz, 25℃)

-9
Dielectric Loss (1MHz, 25℃)-0.001


Packing & Shipment

Package typecarton box with foam protection
Payment terms

TT / Western Union / Paypal

50% payment in advanced and 50% before shipment

Loading port Xiamen, China
Shipping wayBy sea / air / door-to-door express

Aluminum Nitride Ceramic

AlN Ceramic Heat Sink



Why Choose Us

10+ years experience in technical ceramics manufacturing and R&D

ISO9001:2015 certificated quality control management system

Different types of ceramic materials are provided for your different applications

Products have been exported to 40+ countries and have good reputation from our customers

MOQ is low, both prototype and bulk order will keep high quality

Any of your inquiries or questions will be responded no longer than 24 hours

Rigorous production plan to ensure on-time delivery


High Thermal Conductivity AlN


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