News
Application of Advanced ceramic Components in Semiconductor Manufacturing Processes
Precision ceramics find applications in various processes in semiconductor manufacturing, including lithography, etching, deposition, chemical mechanical polishing (CMP), ion implantation, and wire bonding. Through their exceptional performance and properties, precision ceramic components ensure stability, high precision, and reliability in semiconductor manufacturing processes.
07-06-2023-
Application of Advanced ceramic Components in Semiconductor Manufacturing Processes
Precision ceramics find applications in various processes in semiconductor manufacturing, including lithography, etching, deposition, chemical mechanical polishing (CMP), ion implantation, and wire bonding. Through their exceptional performance and properties, precision ceramic components ensure stability, high precision, and reliability in semiconductor manufacturing processes.
07-06-2023 -
Silicon nitride ceramics in the field of new energy vehicles
The two main application directions of silicon nitride ceramics in the field of new energy vehicles are silicon nitride bearings and high thermal conductivity silicon nitride substrates.
06-06-2023 -
Boron Nitride Ceramic Nozzle: Applications and Advantages in Powder Metallurgy and 3D Printing
Powder metallurgy and 3D printing are rapidly advancing fields, and boron nitride ceramic nozzles are emerging as noteworthy applications in these domains.
02-06-2023 -
Ceramic Substrate Series - The Benefits of Ceramic Substrate Grinding and Polishing
Surface grinding and polishing are often required for ceramic substrates prior to the metallization process, and this can be done on either a single or double-sided basis. This step provides three notable advantages
22-05-2023 -
Ceramic Substrate Series - Application of Laser Technology in Ceramic Substrate Field
Due to the large shrinkage during sintering, it is challenging to ensure the dimensional accuracy of ceramic pieces after sintering, including the precise provision of various holes, slots, and edges for assembly purposes. Therefore, post-sintering processing is required. Laser cutting, as a non-contact processing method, ensures that there is no internal stress in the product, resulting in minimal edge chipping, high precision, and high processing yield.
22-05-2023
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Notice for 2023 Labor Day holiday
24-04-2023 -
Notice for 2022 Spring Festival Holiday
27-01-2022