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Precision ceramics find applications in various processes in semiconductor manufacturing, including lithography, etching, deposition, chemical mechanical polishing (CMP), ion implantation, and wire bonding. Through their exceptional performance and properties, precision ceramic components ensure stability, high precision, and reliability in semiconductor manufacturing processes.

The two main application directions of silicon nitride ceramics in the field of new energy vehicles are silicon nitride bearings and high thermal conductivity silicon nitride substrates.

Powder metallurgy and 3D printing are rapidly advancing fields, and boron nitride ceramic nozzles are emerging as noteworthy applications in these domains.

Surface grinding and polishing are often required for ceramic substrates prior to the metallization process, and this can be done on either a single or double-sided basis. This step provides three notable advantages

Due to the large shrinkage during sintering, it is challenging to ensure the dimensional accuracy of ceramic pieces after sintering, including the precise provision of various holes, slots, and edges for assembly purposes. Therefore, post-sintering processing is required. Laser cutting, as a non-contact processing method, ensures that there is no internal stress in the product, resulting in minimal edge chipping, high precision, and high processing yield.

Mascera high purity boron nitride crucibles are suitable for sintering and smelting: 1.Nonferrous & ferrous metals such as Al, Bi, Ge, Sb, Sn, Cd, Pb, Ni, Zn, Cu, Mg, Im, Fe, Stainless Steel... 2.Glass melt, Soda glass, Cryolite 3.Silicon molten salt, fluoride, slag

boron nitride (BN) offers advantages of low wettability, chemical stability, high-temperature stability, and good thermal conductivity in the sintering of aluminum nitride (AlN) and silicon nitride (Si3N4) substrates. These advantages provide a reliable, clean, and high-quality sintering environment, ensuring the substrates are sintered in optimal conditions and maintain the desired performance.

how to implement metallization on ceramic surfaces and improve the bonding strength between the two is the focus of the ceramic substrate metallization process. This article introduces several processes for ceramic substrate metallization.

Ceramic substrates, also known as ceramic circuit boards, include ceramic substrates and metal circuit layers. Common materials for electronic packaging ceramic substrates include aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), and beryllium oxide (BeO).