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Hot-press molding is a widely used forming process in the production of advanced ceramics.It is mainly used to produce small and medium-sized complex structural ceramics, wear-resistant ceramics, electronic ceramics, insulating ceramics, textile ceramics, heat-resistant ceramics, sealing ceramics, corrosion-resistant ceramics, and thermal shock-resistant ceramics.

Ceramic Injection Molding (CIM) is a novel process for manufacturing ceramic components that combines the principles of polymer injection molding with ceramic preparation techniques.

Tape casting, also known as doctor blade casting, is a fundamental ceramic shaping process. Its basic principle involves the flow of ceramic slurry with suitable viscosity and good dispersibility from the slurry trough of a tape caster to the substrate.

Dry pressing is the most widely applied shaping technique, also known as powder pressing, and it is the primary shaping process for specialty ceramics such as microwave dielectric ceramics and semiconductor ceramic components.

Silicon carbide ceramics possess various advantageous properties, including chemical stability, high temperature resistance, wear resistance, corrosion resistance, high thermal conductivity, low thermal expansion coefficient, and high hardness. These qualities make it an ideal material for numerous industries.

Hot-press sintering is generally considered an ideal sintering method, yielding ceramics with high density, strength, and mature production processes, thus finding widespread applications. The other variation is pyrolytic boron nitride (PBN), prepared using chemical vapor deposition (CVD) techniques. Let's compare these two by focusing on hot-pressed boron nitride and pyrolytic boron nitride.

The SAT inspection is based on the physical properties of ultrasonic waves, similar to medical ultrasound examinations or sonar detection in submarines. Ultrasonic waves are transmitted into the ceramic substrate's interior through a certain medium.

​Electronic components operating in harsh environments such as high temperature and high humidity can lead to performance deterioration and even damage. Therefore, effective packaging methods and continuous improvement of packaging materials are required to maintain good stability of electronic components in demanding external conditions.

Active Metal Brazing (AMB) is an advancement of the DBC process. It involves adding a small amount of active elements (e.g., Ti, Zr, V, Cr) to the brazing electronic paste, which is then printed onto the ceramic substrate using screen printing technology.

As the global demand for sustainable energy continues to increase, the new energy industry is rapidly developing. This article will focus on the key applications and developments of DPC (Direct Plating Copper) ceramic substrate technology in new energy production, including its advantages in solar photovoltaics, wind energy generation, and energy storage systems, as well as future trends and challenges.