Ceramic Applications

Silicon carbide ceramics possess various advantageous properties, including chemical stability, high temperature resistance, wear resistance, corrosion resistance, high thermal conductivity, low thermal expansion coefficient, and high hardness. These qualities make it an ideal material for numerous industries.

​Electronic components operating in harsh environments such as high temperature and high humidity can lead to performance deterioration and even damage. Therefore, effective packaging methods and continuous improvement of packaging materials are required to maintain good stability of electronic components in demanding external conditions.

Active Metal Brazing (AMB) is an advancement of the DBC process. It involves adding a small amount of active elements (e.g., Ti, Zr, V, Cr) to the brazing electronic paste, which is then printed onto the ceramic substrate using screen printing technology.

As the global demand for sustainable energy continues to increase, the new energy industry is rapidly developing. This article will focus on the key applications and developments of DPC (Direct Plating Copper) ceramic substrate technology in new energy production, including its advantages in solar photovoltaics, wind energy generation, and energy storage systems, as well as future trends and challenges.

In the new energy vehicle industry, the application of various advanced materials is the foundation that supports the entire industry. In this article, we will explore the increasingly important role of ceramics in the intelligentization process of new energy vehicles.

Direct Bond Copper (DBC) ceramic substrate has become an important electronic packaging material due to its excellent thermal conductivity and electrical conductivity, especially in power modules (IGBT) and integrated power electronic modules.

Alumina ceramic is the most commonly used ceramic substrate material, favored for its overall good performance. The advantages of alumina ceramic substrates include excellent insulation performance, exceptional high-temperature resistance, high strength and hardness, outstanding chemical stability, and good processability.

The application of boron nitride ceramic in horizontal continuous casting is mainly for the use of break rings and crystallizers.

Precision ceramics find applications in various processes in semiconductor manufacturing, including lithography, etching, deposition, chemical mechanical polishing (CMP), ion implantation, and wire bonding. Through their exceptional performance and properties, precision ceramic components ensure stability, high precision, and reliability in semiconductor manufacturing processes.

The two main application directions of silicon nitride ceramics in the field of new energy vehicles are silicon nitride bearings and high thermal conductivity silicon nitride substrates.