Manufacturing & Process

Molybdenum-Manganese Metallization involves applying a composite layer of molybdenum (Mo) and manganese (Mn) onto the surface of a ceramic substrate, typically alumina. This metalized layer is sintered at high temperatures to form a durable bond. The surface is then usually nickel-plated to allow brazing with metal components.

Boron nitride atomizer nozzles for powder metal atomization play a crucial role in the atomization process. These nozzles are responsible for converting molten metal into fine powder particles, which are then used in various industries such as automotive, aerospace, and electronics.

Due to its unique properties, zirconia finds wide applications across various sectors. So, what are the main processing steps for zirconia ceramic products?

According to the Al2O3 content, alumina ceramics are categorized into various types such as 99% alumina, 96% alumina, 95% alumina, 90% alumina, and 85% alumina. So, what are the main processes of alumina ceramic products?

Press molding is a common method used in the preparation of advanced ceramics. This process involves mixing ceramic powders with organic or inorganic additives, then placing the mixture into specially designed molds for shaping under certain temperature and pressure conditions.Press molding is widely used in various ceramic preparation fields. It offers high controllability, repeatability, and production efficiency, allowing for large-scale production, and thus plays a crucial role in advanced ceramic preparation.

It is very important to study the low temperature sintering technology of alumina ceramics, whether for reducing energy consumption, saving cost, or improving performance.

During the preparation of DPC ceramic substrates, uneven distribution of electroplating current leads to non-uniform thickness of the copper layer on the substrate surface (thickness difference can exceed 100μm). Surface grinding is a key process to control the thickness of the electroplated copper layer and improve its uniformity, directly affecting the performance of ceramic substrates and the quality of device packaging.

Ceramic substrates play a vital role in the field of electronics due to their significant advantages such as high thermal conductivity, excellent insulation properties, and thermal conductivity.

As manufacturing enters a new development period, the application of ceramic substrates is becoming increasingly widespread, with higher requirements for surface roughness and flatness. The rapid development of laser polishing technology provides a new approach for intelligent and efficient polishing processing of ceramic substrates.

During the laser marking process of ceramic substrates, it is essential to control the laser processing parameters to avoid excessive heating, which may lead to ceramic cracking or deformation. Laser marking offers advantages such as fine seams, high accuracy, fast marking speed, smooth section, small heat-affected zone, and no substrate damage, providing a reliable processing method for ceramic substrate fabrication. As the microelectronics industry continues to evolve towards miniaturization and lightweighting, demanding higher precision, laser marking technology holds great promise for ceramic substrate processing.