Manufacturing & Process

As a support base for electronic components, ceramic substrates facilitate heat dissipation in electronic devices. After the initial forming of ceramic substrates, they require further processing such as drilling and scribing. Traditional machining methods cannot meet the high-precision machining requirements of ceramic substrates. With the development of laser processing technology, it is gradually becoming the mainstream for precision machining of ceramic substrates.

Silicon carbide ceramic materials exhibit excellent properties such as high-temperature mechanical strength, high hardness, strong oxidation resistance, good radiation resistance, excellent wear resistance, thermal stability, low thermal expansion coefficient, and good chemical corrosion resistance. They find wide applications in various fields including industrial machinery, defense, semiconductor, environmental protection, nuclear energy, among others.

Hot-press molding is a widely used forming process in the production of advanced ceramics.It is mainly used to produce small and medium-sized complex structural ceramics, wear-resistant ceramics, electronic ceramics, insulating ceramics, textile ceramics, heat-resistant ceramics, sealing ceramics, corrosion-resistant ceramics, and thermal shock-resistant ceramics.

Ceramic Injection Molding (CIM) is a novel process for manufacturing ceramic components that combines the principles of polymer injection molding with ceramic preparation techniques.

Tape casting, also known as doctor blade casting, is a fundamental ceramic shaping process. Its basic principle involves the flow of ceramic slurry with suitable viscosity and good dispersibility from the slurry trough of a tape caster to the substrate.

Dry pressing is the most widely applied shaping technique, also known as powder pressing, and it is the primary shaping process for specialty ceramics such as microwave dielectric ceramics and semiconductor ceramic components.

The SAT inspection is based on the physical properties of ultrasonic waves, similar to medical ultrasound examinations or sonar detection in submarines. Ultrasonic waves are transmitted into the ceramic substrate's interior through a certain medium.

The development of ceramic sintering technology directly influences the progress of advanced ceramic materials and is an essential key step in ceramic product manufacturing.Based on the research target, sintering can be categorized into solid-state sintering and liquid-phase sintering. Depending on the specific processes, sintering methods include pressureless sintering, hot pressing, hot isostatic pressing, atmosphere sintering, microwave sintering, spark plasma sintering, and others.

Ceramic metallization refers to firmly adhering a thin layer of metal film to the ceramic surface to achieve welding between ceramic and metal. There are various ceramic metallization processes, including molybdenum-manganese method, gold plating method, copper plating method, tin plating method, nickel plating method, and LAP method (laser-assisted plating).

Due to the large shrinkage during sintering, it is challenging to ensure the dimensional accuracy of ceramic pieces after sintering, including the precise provision of various holes, slots, and edges for assembly purposes. Therefore, post-sintering processing is required. Laser cutting, as a non-contact processing method, ensures that there is no internal stress in the product, resulting in minimal edge chipping, high precision, and high processing yield.