Blog

Hexagonal boron nitride (h-BN) is a crystalline structure composed of nitrogen and boron atoms arranged in a hexagonal lattice. It is the only phase of boron nitride that exists naturally in the environment. It appears as a soft, loose, smooth, and moisture-absorbing white powder, and it shares similar layered structure characteristics with graphene, earning it the nickname "white graphite."

Direct Bond Copper (DBC) ceramic substrate has become an important electronic packaging material due to its excellent thermal conductivity and electrical conductivity, especially in power modules (IGBT) and integrated power electronic modules.

Alumina ceramic is the most commonly used ceramic substrate material, favored for its overall good performance. The advantages of alumina ceramic substrates include excellent insulation performance, exceptional high-temperature resistance, high strength and hardness, outstanding chemical stability, and good processability.

The application of boron nitride ceramic in horizontal continuous casting is mainly for the use of break rings and crystallizers.

Precision ceramics find applications in various processes in semiconductor manufacturing, including lithography, etching, deposition, chemical mechanical polishing (CMP), ion implantation, and wire bonding. Through their exceptional performance and properties, precision ceramic components ensure stability, high precision, and reliability in semiconductor manufacturing processes.

The two main application directions of silicon nitride ceramics in the field of new energy vehicles are silicon nitride bearings and high thermal conductivity silicon nitride substrates.

Powder metallurgy and 3D printing are rapidly advancing fields, and boron nitride ceramic nozzles are emerging as noteworthy applications in these domains.

Boron nitride ceramic plays a key role in electric propulsion technology and plasma thrusters, providing essential support for the performance and reliability of the thrusters. Its excellent high-temperature resistance, good insulation properties, and corrosion resistance make it an ideal material choice.

Due to the large shrinkage during sintering, it is challenging to ensure the dimensional accuracy of ceramic pieces after sintering, including the precise provision of various holes, slots, and edges for assembly purposes. Therefore, post-sintering processing is required. Laser cutting, as a non-contact processing method, ensures that there is no internal stress in the product, resulting in minimal edge chipping, high precision, and high processing yield.

Surface grinding and polishing are often required for ceramic substrates prior to the metallization process, and this can be done on either a single or double-sided basis. This step provides three notable advantages