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Al2O3 Alumina Ceramic Substrate Pcb

  • Al2O3 Alumina Ceramic Substrate Pcb
  • Al2O3 Alumina Ceramic Substrate Pcb
  • Al2O3 Alumina Ceramic Substrate Pcb
  • Al2O3 Alumina Ceramic Substrate Pcb
  • Al2O3 Alumina Ceramic Substrate Pcb
  • Al2O3 Alumina Ceramic Substrate Pcb
Al2O3 Alumina Ceramic Substrate Pcb
  • MASCERA
  • Xiamen, China
  • 7-30 days according to stock status
  • 500k pieces per month

Ceramic PCBs have much beter heat dissipation performance, current-carrying capacity, electrical insulation, thermal expansion coefficient than ordinary glass fiber PCB board. Unlike ordinary PCBs, which use adhesives to bond copper foil and substrate together, ceramic PCBs are produced by bonding the copper foil and ceramic substrate directly in a high temperature environment. Ceramic PCBs have strong bonding force, copper foil will not fall off, leading to high reliability and stable performance under high temperature and high humidity environment. Ceramic PCBs are widely used in high-power electronic modules, aerospace, military electronics and other products.

Any inquiry please email info@mascera-tec.com or call +86 13860446139

Al2O3 Alumina Ceramic Substrate Pcb

Product Information
Item No.
MSJ/CS-004
BrandMASCERA
Material for ceramic layer96% alumina ceramic / aluminum nitride ceramic
Thickness of substrate0.25mm-1.0mm
Sizecustomized as per required specification
Copper layer thickness
0.01-0.30mm
Metallization TechnologyDPC or DBC
Surface finish

Bare Copper

Tin plating

Au Plating

Ni Plating

Immersion gold

MOQ100 pcs
Application
high power electronic modules



Ceramic PCBs have much better heat dissipation performance, current-carrying capacity, electrical insulation, thermal expansion coefficient than ordinary glass fiber PCB board. Unlike ordinary PCBs, which use adhesives to bond copper foil and substrate together, ceramic PCBs are produced by bonding the copper foil and ceramic substrate directly in a high temperature environment. Ceramic PCBs have strong bonding force,  copper foil will not fall off,  leading to high reliability and stable performance under high temperature and high humidity environment. Ceramic PCBs are widely used in high-power electronic modules, aerospace, military electronics and other products.


Mascera is able to provide ceramic PCBs with alumina ceramic substrates and aluminum nitride substrates. Alumina ceramic is the most commonly used material for ceramic substrates which have good mechanical strength, heat resistance, impact resistance, electrical insulation and corrosion resistance. Because of the sufficient raw materials, affordable prices, and complete manufacturing and processing systems, alumina ceramic PCBs are the most cost-effective in the electronic packaging industry. Comparing with alumina ceramic substrate, aluminum nitride ceramic substrates have much higher thermal conductivity (7-10 times that of alumina ceramic), and its coefficient of thermal expansion (CTE) is close to that of silicon wafers, they are widely used in high-power semiconductor modules or large-scale integrated circuits.



Available Metallization Technology

Mascera develops two metallization technologies to produce ceramic PCB, one is DBC (direct bonding copper) and DPC (direct plating copper). DBC is suitable for circuits that line width and thickness are not critical, DPC is used to produce circuits that line size should be accurately controlled.


Item
DBCDPC

Metallization Method

Direct Bonding Copper

Magnetron Sputtering + Electroplating

Ceramic Substrate Type

96% Al2O3

96% Al2O3 or AlN

Thickness of Ceramic Substrates

0.25mm / 0.38mm / 0.5mm /0.63mm / 0.8mm /1.0mm

0.25mm / 0.38mm / 0.5mm /0.63mm / 0.8mm /1.0mm

Maxim Size

140 x 190mm

140 x 190mm

Metal Layer Material

Copper

Copper

Metallization Surface

Single or Double

Single or Double

Copper Layer Thickness

70-300μm

>17.5μm

Bonding Strength

>4.5N/mm

3N/mm

Minimum Line Width

0.2mm

0.1mm

Minimum Line Spacing

0.2mm

0.1mm

Surface Finish

OSP

Ni Plating

OSP

Immersion gold

Immersion Ag

Immersion Tin


Feature of Ceramic PCB


  • Large current carrying capacity

  • Better heat dissipation performance, low thermal expansion coefficient, stable shape, not easy to deform and warp.

  • Good insulation, high pressure resistance, to ensure personal safety and equipment.

  • Strong bonding force, using bonding technology, the copper foil will not fall off.

  • High reliability, stable performance under high temperature and high humidity environment



Data Sheet for Ceramic Substrates


Item
UnitTechnical Parameters
Material Type---96% AL2O3 CeramicAlN Ceramic
Purity---96%95%
Color---WhiteLight Grey
Densityg/cm3≥3.72≥3.3
Warpage---≤3‰*Length≤2‰*Length
Water Absorption---0%0%
Flexural StrengthMpa≥350365-420
Thermal conductivity (25)W/M.K 24≥170
Thermal expansion coefficient
(20~300)
10-6mm/84.6
Maxim Operation Temp.16501800
Dielectric constant
(1MHz&25)
---
9~108.8
Dielectric Loss
(1MHz&25)
---0.00030.0003
Dielectric strengthKV/mm1717
Volume resistivityΩ.cm1014>1013



Typical Application of Ceramic PCB


  • High-power power electronic modules, solar panel components, etc.

  • High frequency switching power supply, solid state relay

  • Automotive electronics, aerospace, military electronics

  • High-power LED lighting products

  • Communication antenna, car ignition



Packing & Shipment


Package typecarton box with foam protection
Payment terms

TT / Western Union / Paypal

50% payment in advanced and 50% before shipment

Loading port Xiamen, China
Shipping wayBy sea / air / door-to-door express

ceramic substrate pcb

ceramic pcb



Why Choose Us


  1. 10+ years experience in technical ceramics manufacturing and R&D

  2.  ISO9001:2015 certificated quality control management system

  3.  Different types of ceramic materials are provided for your different applications

  4.  Products have been exported to 40+ countries and have good reputation from our customers

  5. MOQ is low, both prototype and bulk order will keep high quality

  6. Any of your inquiries or questions will be responded no longer than 24 hours

  7. Rigorous production plan to ensure on-time delivery


alumina ceramic pcb



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