ceramic substrate

96% Alumina substrates are the most cost-effective and commonly used ceramic substrate for thick film electronics or power powdules, they are made of electrically insulated 96% alumina (al2o3) ceramic. Alumina substrates have advantages of good electrical insulation, low dielectric properties, good heat resistance and wear resistance. The good thermal conductivity will help electronic modules to dissipate heat efficiently. The shape is stable because of the high strength and good durability, the surface is smooth and flatness is as good as 2‰ of dimensions. Any inquiry please email info@mascera-tec.com or call +86 13860446139

Ceramic PCBs have much beter heat dissipation performance, current-carrying capacity, electrical insulation, thermal expansion coefficient than ordinary glass fiber PCB board. Unlike ordinary PCBs, which use adhesives to bond copper foil and substrate together, ceramic PCBs are produced by bonding the copper foil and ceramic substrate directly in a high temperature environment. Ceramic PCBs have strong bonding force, copper foil will not fall off, leading to high reliability and stable performance under high temperature and high humidity environment. Ceramic PCBs are widely used in high-power electronic modules, aerospace, military electronics and other products. Any inquiry please email info@mascera-tec.com or call +86 13860446139

Aluminum nitride substrates are widely applied in large-scale integrated circuits or high power modules because of much higher thermal conductivity than other ceramic materials. Aluminum nitride susbtrates's thermal conductivity is as high as 170 w/mk, which will dissipate heat and cool down the circuits much more quickly. Adding with good insulating properties, aluminum nitride substrates are the best solution in electronics applications where fast heat dissipation is critical. Alumium nitride substrates are heat resistant and have similar expansion coefficient of silicon, which will keep high reliability of Si chip and thermal heat cycling. Any inquiry please email info@mascera-tec.com or call +86 13860446139

MASCERA provides various processing treatments on the surface of the ceramic substrate, such as metallization, polishing, laser scribing, and laser drilling. Additionally, we offer customization services for Nitride Silicon Ceramic Substrates in different sizes. You can provide us with drawings or product size requirements, and we will fulfill your requests accordingly. Any inquiry please email info@mascera-tec.com or call +86 13860446139

DBC(Direct Bonded Copper) is one of the main metallization for ceramic substrates. The copper foils can be directly bonded on single or double surfaces of ceramic substrates (alumina ceramic or aluminum nitride) without a middle layer, reducing the contact thermal resistance between the metal layer and the ceramic layer, getting better heat dissipcation capability. DBC substrates have not only the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics of ceramics, but also the high electrical conductivity and excellent soldering performance of oxygen-free copper, and can be carved into various graphics like a PCB circuit board. Any inquiry please email info@mascera-tec.com or call +86 13860446139