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Direct Bonded Copper Dbc Ceramic Substrate

  • Direct Bonded Copper Dbc Ceramic Substrate
  • Direct Bonded Copper Dbc Ceramic Substrate
  • Direct Bonded Copper Dbc Ceramic Substrate
Direct Bonded Copper Dbc Ceramic Substrate
  • MASCERA
  • Xiamen, China
  • 7-30 days according to stock status
  • 500k pieces per month

DBC(Direct Bonded Copper) is one of the main metallization for ceramic substrates. The copper foils can be directly bonded on single or double surfaces of ceramic substrates (alumina ceramic or aluminum nitride) without a middle layer, reducing the contact thermal resistance between the metal layer and the ceramic layer, getting better heat dissipcation capability.

DBC substrates have not only the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics of ceramics, but also the high electrical conductivity and excellent soldering performance of oxygen-free copper, and can be carved into various graphics like a PCB circuit board.

Any inquiry please email info@mascera-tec.com or call +86 13860446139

Direct Bonded Copper Dbc Ceramic Substrate

Product Information
Item No.
MSJ/CS-003
Typemetallized ceamic substrate
Sizecustomized as per required specification
Material of ceramic layer96% alumina ceramic
Thickness of ceramic layer0.25-1.0mm
Metallization MethodDBC (direct bonded copper)
Copper layer thickness
0.07-0.30mm
Surface finish

OSP

Ni Plating

MOQ100pcs
Application
ceramic substrate for electronic circuit or modules

dbc ceramic substrate


DBC(Direct Bonded Copper) is one of the main metallization for ceramic substrates. The copper foils can be directly bonded on single or double surfaces of ceramic substrates (alumina ceramic or aluminum nitride) without a middle layer, reducing the contact thermal resistance between the metal layer and the ceramic layer, getting better heat dissipcation capability. 


DBC substrates have not only the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics of ceramics, but also the high electrical conductivity and excellent soldering performance of oxygen-free copper, and can be carved into various graphics like a PCB circuit board. 


DBC substrates are widely applied in high-speed rail, automotive electronics, industrial electronics, communications, military, aerospace and other fields. Benefiting from the excellent current carrying capacity, voltage endurance capability and heat dissipation capacity, DBC substrates are generally used in areas with relatively large currents and large resistances, such as high-power modules and high-power devices.  



Feature of DBC Substrates

  • High mechanical strength, mechanically stable shape;

  • Excellent heat dissipation capability

  • Excellent current carrying capacity

  • Good electrical insulation

  • Strong bonding strength between ceramic substrate and copper layer

  • Much better thermal cycling capability (up to 50k cycles)

  • Can be etched like PCB boards to get required graphics

  • The process is simple, no need for MO-MN metallization process



Features of DBC VS DPC

ItemDBCDPC

Thickness of copper

thick

thin

Width of line

thick

thin

Spacing of line

big

small

Graphics accuracy6

high

low

Surface roughness

normal

good

Via holes

Available

Unavailable

Use for high current devices (IGBT etc.)

suitable

Not suitable



Material Properties for Ceramic 96% Alumina Ceramic

ItemUnitTechnical Parameters

Material Type

---

96% AL2O3 Ceramic

Purity

---

96%

Color

---

White

Density

g/cm3

≥3.72

Warpage

---

≤3‰*Length

Water Absorption

---

0%

Flexural Strength

Mpa

≥350

Thermal conductivity (25)

W/M.K

24

Thermal expansion coefficient

(20~300)

10-6mm/

8

Maxim Operation Temp.

1650

Dielectric constant

(1MHz&25)

---

9~10

Dielectric Loss

(1MHz&25)

---

0.0003

Dielectric strength

KV/mm

17

Volume resistivity

Ω.cm

1014



Typical Application of DBC Substrates

  • Power semiconductor modules; semiconductor refrigerator, electronic heating device, power control circuits, power hybrid circuits

  • Smart power modules, high frequency switch, solid state relays

  • Automobile electronics, military and aerospace electronics

  • Solar panel assemblies, telecommunication exchange and receiving system, laswer electronics



Packing & Shipment

Package typecarton box with foam protection
Payment terms

TT / Western Union / Paypal

50% payment in advanced and 50% before shipment

Loading port Xiamen, China
Shipping wayBy sea / air / door-to-door express

dbc substrate

direct bonded copper substrate



Why Choose Us

  1. 10+ years experience in technical ceramics manufacturing and R&D

  2.  ISO9001:2015 certificated quality control management system

  3.  Different types of ceramic materials are provided for your different applications

  4.  Products have been exported to 40+ countries and have good reputation from our customers

  5. MOQ is low, both prototype and bulk order will keep high quality

  6. Any of your inquiries or questions will be responded no longer than 24 hours

  7. Rigorous production plan to ensure on-time delivery

dbc ceramic substrate



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